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thermal gap filler pad TIF300 Grey

导热硅胶片
January 30, 2021
Category Connection: Gap Filler termico
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Tags:
#riempitore termicamente conduttivo #silicone di conducibilità termica #materiali a cambiamento di fase ad alta temperatura
Brief: Discover the Grey 2.5 W/mK Compressible Conductive Heatsink Thermal Gap Filler with Adhesive Backing, ideal for enhancing heat dissipation in electronic components. This TIF300 Grey pad offers excellent thermal conductivity, flexibility, and low stress for various applications.
Related Product Features:
  • High thermal conductivity of 2.5 W/mK for efficient heat dissipation.
  • Naturally tacky surface eliminates the need for additional adhesive.
  • Soft and compressible design reduces stress on components.
  • Available in multiple thicknesses to suit different applications.
  • Suitable for LED lighting, automotive units, and telecommunications hardware.
  • Fire-rated 94 V0 for enhanced safety in electronic applications.
  • Can be customized with adhesive on one or both sides.
  • Reinforcement options available for added durability.
Domande frequenti:
  • How do I request customized samples of the thermal gap filler?
    You can request samples by leaving a message on our website, sending an email, or calling us directly.
  • What test methods are used to measure thermal conductivity?
    Thermal conductivity is tested using Hot Disk and ASTM D5470 methods to ensure accurate data.
  • How do I choose the right thermal conductivity for my application?
    The choice depends on your power source wattage and heat dissipation needs. Share your application details with us for a tailored recommendation.
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