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heat sink thermal padTIF700GP Grey

导热硅胶片
January 30, 2021
Categoria di collegamento: cuscinetto conduttivo termico
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Tag:
#materiale conduttivo termico #cuscinetto termicamente conduttivo #cuscinetto del termale del CPU
Breve: Let’s dive in — see this solution in action and notice the key moments. In this video, we demonstrate the TIF700GP Grey thermal pad, a 3W/mk soft compressible material designed for efficient LED heat dissipation. You'll see how its inherent tack and moldability make installation simple for complex parts like CPUs, GPUs, and automotive electronics, ensuring reliable thermal management.
Caratteristiche del prodotto correlate:
  • Offers a thermal conductivity of 3.0 W/mK for effective heat dissipation from components like LEDs, CPUs, and memory modules.
  • Features inherent tack on both sides, eliminating the need for separate adhesive layers and simplifying application.
  • Available in a wide range of standard and custom thicknesses from 0.020 inches to 0.200 inches to fit various design requirements.
  • Has a specific gravity of 2.75 g/cc and a soft 45 Shore 00 hardness, providing compressibility and conformability.
  • Constructed from ceramic-filled silicone rubber, ensuring durability and a continuous use temperature range from -50°C to 200°C.
  • Achieves a UL 94 V-0 fire rating, offering enhanced safety for use in electronic applications.
  • Moldable for complex parts, making it suitable for intricate assemblies in notebooks, power supplies, and set-top boxes.
  • Provides high dielectric breakdown voltage (>10,000 VAC) and volume resistivity for reliable electrical insulation.
Domande frequenti:
  • What is the thermal conductivity of the TIF700GP Grey thermal pad?
    The thermal pad has a thermal conductivity of 3.0 W/mK, making it highly effective for dissipating heat in applications like LEDs, CPUs, and graphics cards.
  • Does this thermal pad require an additional adhesive for installation?
    No, the pad features inherent tack on both sides, so it adheres securely without needing separate adhesive layers, which helps maintain optimal thermal performance.
  • What thickness options are available for this compressible thermal pad?
    It is available in standard thicknesses ranging from 0.020 inches (0.51 mm) to 0.200 inches (5.08 mm), with custom configurations available upon request to meet specific design needs.
  • What applications is the TIF700GP thermal pad suitable for?
    This pad is designed for a variety of electronics, including CPUs, display cards, motherboards, notebooks, power supplies, automotive electronics, memory modules, and set-top boxes.
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