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Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
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Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Grande immagine :  Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies

Dettagli:
Luogo di origine: Cina, Dongguan.
Marca: ZIITEK
Certificazione: UL and RoHs
Numero di modello: TIF100-30-10S
Documento: TIF100-30-10S_Data Sheet.pdf
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: Negoziabile
Imballaggi particolari: 1000 PZ/BORSA
Tempi di consegna: 3-5 giorni di lavoro
Termini di pagamento: T/T
Capacità di alimentazione: 100000/giorno
Descrizione di prodotto dettagliata
Nome del prodotto: Riempitore termico che offre morbidezza e conduttività termica superiori per migliorare il raffredda Costruzione e composizione: Elastomero siliconico caricato con ceramica
Costante dielettrica @1MHz: 5.0 Applicazione: Migliora il raffreddamento e l'affidabilità degli assemblaggi elettronici
campione: Campione gratuito Temperatura operativa consigliata (°C): -40 a 200℃
Conducibilità termica (w/mk): 3.0W/mK Durezza: 65/45 Shore 00
Valutazione della fiamma: UL94V-0 Parole chiave: Riempitivo di gap termico
Densità: 30,15 g/cm3

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies


Products description


TIF®100-30-10S Series is a well-balanced,general-purpose thermal pad. It offers good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features


 > Good thermal conductivity
 > Moldability for complex parts
 > Soft and compressible for low stress applications
 > Naturally tacky needing no further adhesive coating
 > Available in varies thicknesses

Applications

 > Home appliance industry
 > Power module
 > Wearable device
 > Solar photovoltaic panel
 > LED lighting fixtures

 > Power tools
 > Network communication products
 > Electric vehicle batteries
 > Computer CPU/GPU Cooling
 > New energy vehicle power systems

Key attributes

Typical Properties of TIF®100-30-10S Series
Property Value Test method
Colo Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.15 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 5.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16” (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 0

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 1

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 2

Independent R&D team


Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.


FAQ


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How to find a right thermal conductivity for my applications 

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.  


Q: Do you accept custom orders ?  

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .


Exhibition desplay 

Thermal Gap Filler Offering Superior Softness and Thermal Conductivity to Enhance Cooling and Reliability of Electronic Assemblies 3


Dettagli di contatto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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