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10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays

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Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
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10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays

10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays
10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays 10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays 10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays

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Dettagli:
Luogo di origine: Cina
Marca: ZIITEK
Certificazione: UL and RoHs
Numero di modello: TIF10010020-11
Documento: TIF100 10020-11_Data Sheet.pdf
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: Negoziabile
Imballaggi particolari: 1000 PZ/BORSA
Tempi di consegna: 3-5 giorni lavorativi
Termini di pagamento: T/T
Capacità di alimentazione: 100.000 pezzi/giorno

10W/mK Thermal Conductivity Excellent Electrical Insulation Thermally Conductive Gap Filler Pads For Flat-panel Displays

descrizione
Applicazione: Display a schermo piatto Parole chiave: Pad di riempimento di lacune termicamente conduttivi
Durezza: 20 riva 00 Colore: Grigio scuro
Conducibilità termica: 10.0W/m-K Nome dei prodotti: Eccellente isolamento elettrico Elevata conducibilità termica Cuscinetti riempitivi termicamente con
Tensione di rottura (V/mm): ≥5500 VAC campione: gratuito
Temperatura operativa consigliata (%22°C): -40 a 200℃ Peso specifico: 3.3 g/cm3

Excellent Electrical Insulation High Thermal Conductivity 10W/mK Thermally Conductive Gap Filler Pads For Flat-panel Displays
Product Overview

TIF®100 10020-11 Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces, and the susceptibility of delicate components to mechanical damage.

Key Features
  • Excellent thermal conductivity 10.0W/m·K
  • High compression rate
  • Extremely low thermal impedance
  • Excellent insulator
Applications
  • Between CPU and heat sink
  • Between a component and heat sink
  • Flat-panel displays
  • Power supplies
  • High speed mass storage drives
  • Telecommunication hardware
  • 5G base station & infrastructure
  • High-end Chip
Technical Specifications
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.3 ASTM D792
Thickness Range (inch/mm) 0.012~0.020 | 0.030~0.200
0.30~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 20 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 6.4 ASTM D150
Volume Resistivity (Ohm-meter) >1.0*10¹² ASTM D257
Flame Rating V-0 UL 94 (E331100)
Thermal Conductivity 10.0 W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.012" (0.30 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"*16" (406 mm*406 mm)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

Independent R&D team working on thermal interface materials
Ordering Information
How do I place an order?

1. Click the "Send messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us. This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

Frequently Asked Questions
What's the thermal conductivity test method given on the data sheet?
All the data in the sheet are actual tested. Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
How to find a right thermal conductivity for my applications?
It depends on the watts of power source, ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Do you accept custom orders?
Yes, welcome to custom orders. Our custom elements including dimension, shape, color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order, please kindly offer a drawing or leave your custom order information.

Dettagli di contatto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona di contatto: Dana Dai

Telefono: +86 18153789196

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