Il cuscinetto conduttivo termico è guardante e lavorante molto buon. Ora non abbiamo esigenza dell'altro cuscinetto conduttivo termico!
—— Peter Goolsby
Avevo cooperato con Ziitek per 2 anni, hanno fornito i materiali conduttivi termici di alta qualità e la consegna a tempo, raccomanda i loro materiali a cambiamento di fase
—— Antonello Sau
Buona qualità, buon servizio. Il vostro gruppo sempre ci dà l'aiuto e la risoluzione, speranza che saremo buon partner continuamente!
High Performance Acrylic Adhesive Heat-Conducting Double-Sided Adhesive The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductor... Leggi di più
High Temperature Heat Resistant Acrylic Adhesive Double Sided Thermal Conductive Tape for LED Light Heat dissipation tape The TIA™800FG Series products are mostly used for bonding heat dissipation fins, ... Leggi di più
The TIA™810FG Acrylic Thermally Adhesive Tape For LED Mount Heat Sink Conductive tape 0.9 W/MK The TIA™810FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Leggi di più
Glass Fiber Backing Thermal Adhesive Tape For LED Mount Heat Sink with 0.8 W/mK double adhesive The TIA™820FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power ... Leggi di più
Acrylic Thermal Adhesive Tape For LED Mount Heat Sink Conductive 0.8 W/MK The TIA™805FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconduct... Leggi di più
2.0W /mK thermal gap filler pad 3mmT Ziitek TIF4120 for Heat Sinking Housing at LED-lit BLU in LCD Company ProfileZiitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal ... Leggi di più
Excellent Flexibility Thermal Conductive High Heat Plastic Housings for LED Lamps Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal ... Leggi di più
Thermal conductive adhesive fire resistance tape TIA608P 0.2mm thickness for bonding heat microprocessors The TIA608P Series products are mostly used for bonding heat dissipation fins, microprocessors and other ... Leggi di più
Gray Heat Dissipation Fins Thermal Gap Filler For notebook, -40 - 160℃ Continuos Use Temp 3.0 W/m-K The TIF120-30-11US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the ... Leggi di più
Pink Color Thermal Heat Conductivity Materials Silicone Laptop Gap Filler Pad The TIF110FG-14E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ... Leggi di più