8.5W/mK Silicone Thermal Pads for GPU CPU LED -40℃ to 200℃

TIF ®700RES Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effectively enhances the efficiency and life-time of the heat-generating electronic components.

• Excellent thermal conductivity: 8.5W/mK
• Naturally tacky needing no further adhesive coating
• High compliance adapts to various pressure application environments
• Available in different thickness options
• RoHS compliant
• UL recognized

• Heat dissipation structure for radiators
• Telecommunication equipment
• Automotive electronics
• Battery packs for electric vehicles
• LED TV and lamps
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)
• CPU

Standard Thickness: 0.04" to 0.12" (1.0 to 3.00 mm) with increments of 0.01 (0.25 mm).

Standard Size: 16"X16"(406 mm×406 mm).

The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

The packaging of thermal pad:

• With PET film or foam for protection
• Use Paper Card To Separate Each Layer
• Export carton inside and outside
• Meet with customers' requirement-customized

Lead Time: Quantity(Pieces):5000
Est. Time(days): To be negotiated

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease, Thermal Conductive plastic, Silicone Rubber, Silicone Foams, Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Independent R&D team