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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Il cuscinetto conduttivo termico è guardante e lavorante molto buon. Ora non abbiamo esigenza dell'altro cuscinetto conduttivo termico!

—— Peter Goolsby

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—— Antonello Sau

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CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers

Grande immagine :  CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers

Dettagli:
Luogo di origine: Cina
Marca: ZIITEK
Certificazione: UL and RoHs
Numero di modello: TIF700PU
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: Negoziabile
Imballaggi particolari: 1000pcs/borsa
Tempi di consegna: 3-5 giorni lavorativi
Capacità di alimentazione: 100000pcs/giorno
Descrizione di prodotto dettagliata
Nome dei prodotti: Cuscinetto termico in silicone fustellato ad alta conducibilità termica CPU per processori AI Server Colore: Grigio
Conducibilità termica: 7.5W/m-K Durezza: 27 Shore 00
Peso specifico: 30,45 g/cc Continuos usa temp: -40 a 200℃
Tensione di rottura dielettrica: ≥5500 VCA Parole chiave: cuscinetto termico del silicone
Applicazione: Processori AI Server AI

CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers

 
The TIF®700PU Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensitive to extreme mechanical stress. It combines excellent thermal conductivity with a near-fluid ultimate softness, ensuring perfect flling of the contact interface even under ultra-low mounting pressure, completely eliminating air thermal resistance,and providing superior thermal solutions and physical protection for the most precise and highest heat flux electronic components.

Features

> Excellent thermal conductivity:7.5 W/mK
> Extremely soft,low compression stress effectively protects sensitive components
> Self-adhesive without the need for additional surface adhesives
> High insulation performance

Applications

> Al Servers
> Semiconductor Packaging
> Low-Altitude Aircraft
> Optical Communication Products
> 5G Base Stations
 
Typical Properties of TIF®700PU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.45 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
0.50~0.75 1.0~5.0
Hardness 70 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 7.5 W/m-K ASTM D5470
7.5 W/m-K ISO22007
 
Product Specifications

Standard Thickness:0.02" (0.50 mm)~0.20" (5.00 mm) with increments of 0.01" (0.25 mm)
Standard Size: 16"X 16" (203 mmX406 mm)

Component Codes:
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 
CPU High Thermal Conductivity Die Cut Silicon Thermal Pad for AI Processors AI Servers 0
Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Company profile

 

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

 

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

Dettagli di contatto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona di contatto: Dana Dai

Telefono: 18153789196

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