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High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
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High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Grande immagine :  High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling

Dettagli:
Luogo di origine: Cina
Marca: ZIITEK
Certificazione: UL and RoHs
Numero di modello: TIF500-50-11E
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: Negoziabile
Imballaggi particolari: 1000 PZ/BORSA
Tempi di consegna: 3-5 giorni di lavoro
Termini di pagamento: T/T
Capacità di alimentazione: 10000/giorno
Descrizione di prodotto dettagliata
Nome del prodotto: Produttore di cuscinetti termici ad alte prestazioni Cuscinetto di raffreddamento termico in silicon Parole chiave: Cuscinetto di raffreddamento termico in silicone
Applicazione: Raffreddamento dei processori AI per laptop Conduttività termica: 5.0W/m-k
Durezza: 35 riva 00 Intervallo di spessore: 0,25~5,0 mm(0,010~0,20 pollici)
Colore: Grigio scuro Costruzione e composizione: Elastomero siliconico caricato con ceramica

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling


Company Profile


Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.
 

Products description


TIF®500-50-11E Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Easy release construction
> Electrically isolating
> High durability


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

 

 

Typical Properties of TIF®500-50-11E Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 35 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 9.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

High Performance Thermal Pad Manufacturer Soft Silicone Thermal Cooling Pad For Laptop AI Processors Cooling 1

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

Dettagli di contatto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona di contatto: Dana Dai

Telefono: 18153789196

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