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Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Cina Dongguan Ziitek Electronic Materials & Technology Ltd. Certificazioni
Il cuscinetto conduttivo termico è guardante e lavorante molto buon. Ora non abbiamo esigenza dell'altro cuscinetto conduttivo termico!

—— Peter Goolsby

Avevo cooperato con Ziitek per 2 anni, hanno fornito i materiali conduttivi termici di alta qualità e la consegna a tempo, raccomanda i loro materiali a cambiamento di fase

—— Antonello Sau

Buona qualità, buon servizio. Il vostro gruppo sempre ci dà l'aiuto e la risoluzione, speranza che saremo buon partner continuamente!

—— Chris Rogers

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Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Grande immagine :  Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

Dettagli:
Luogo di origine: Cina
Marca: ZIITEK
Certificazione: UL and RoHs
Numero di modello: TIF700NU
Termini di pagamento e spedizione:
Quantità di ordine minimo: 1000 pezzi
Prezzo: Negoziabile
Imballaggi particolari: 1000 PZ/BORSA
Tempi di consegna: 3-5 giorni di lavoro
Termini di pagamento: T/T
Capacità di alimentazione: 10000/giorno
Descrizione di prodotto dettagliata
Nome dei prodotti: Cuscinetti riempitivi ultra morbidi da 6,5 ​​W termicamente conduttivi per il raffreddamento della C Temp. uso continuo: -45 ℃ a 200 ℃
Conducibilità termica e composizione: 6.5W/m-K Densità: 30,4 g/cc
Durezza: 60/27 riva 00 Colore: grigio
Spessore: 0.020" ((0.5mm) ~ 0.200" ((5.0mm) Costruzione: Elastomero siliconico caricato con ceramica
Parole chiave: Cuscinetto termico ultra morbido Applicazione: Raffreddamento CPU/GPU del computer

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling

 

TIF®700NU is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.


Features:

 

> Higt thermal conductivity 6.5W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

 

Applications


> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

 

Typical Properties of TIF®700NU Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.020~0.030 0.040~0.200 ASTM D374
(0.50~0.75) (1.0~5.0)
Hardness 60 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity >1.0X1012Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5 W/m-K ASTM D5470
6.5 W/m-K ISO22007

 

Product Specifications
Standard Thickness:0.020" (0.50 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Ultra-Soft 6.5W Thermally Conductive Gap Filler Pads For Computer CPU/GPU Cooling 0
Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Dettagli di contatto
Dongguan Ziitek Electronic Materials & Technology Ltd.

Persona di contatto: Dana Dai

Telefono: 18153789196

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